1.Yu-Lin Kuo, Chiapyng Lee,T, Jing-Cheng Lin, Yee-Wen Yen, Wen-Horng Lee Evaluation of the thermal stability of reactively sputtered (Ti, Zr)Nx nano-thin films as diffusion barriers between Cu and Silicon, Thin Solid Films, 2005-08
2. Wen-Horng Lee(李文鴻)*,Yu-Lin Kuo, Hong-Ji Huang, Chiapyng LeeEffect of density on the diffusion barrier property of TiNx films between Cu and Si, Materials Chemistry and Physics, 2004
3. Yu-Lin Kuo, Jui-Jen Huang, Chiapyng Lee*,Wen-Horng Lee(李文鴻), Diffusion Barrier Properties of Sputtered TaNx Between Cu and Si Using TaN as the Target Materials Chemistry and Physics, 2003
4.Lee,W. H,(李文鴻) , Lin, J. C., Lee*, C., Cheng, H. C., and Yew T. R.Effects of CH4/SiH4 Flow Ratio and Microwave Power on the Growth of β-SiC on Si by Electron Cyclotron Resonance Chemical Vapor Deposition using CH4/SiH4/Ar at 200 °C, Thin Solid Films, 2001
5. Lee,W. H,(李文鴻), Lin, J. C., Lee, C*., Cheng, H. C., Yew, T. RA Comparative Study of Ar and H2 as the Carrier Gas for the Growth of SiC Films on Si(100) by Electron Cyclotron Resonance Chemical Vapor Deposition at Low Temperatures. Diamond and Related Materials, 2001
6. Lee,W. H,(李文鴻),Lin, J. C., and Lee C.*Characterization of Tantalum Nitride Films Deposited by Sputtering of Ta in N2/Ar Gas Mixtures, Materials Chemistry and Physics, 2001
7.Cheng, K. L., Cheng,Lee,W. H,(李文鴻), H. C., Lee, C., Liu, C. C.,Yew, T. R.*Deposition of Polycrystalline β-SiC Films on Si Substrates at Room Temperature, Appl. Phys. Lett. 1997
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